Features:

• Innovative mechanical design that integrates the top heater, split-vision alignment, pre-heater and board holder into one body.
• Simple controls and intuitive display via the LCD screen.
• 900Watts enhanced pre-heater with 250 x 200 mm effective heating area.
• Micro-processor controlled system with manual or automated reworking modes.
• Automated reworking with four programmable reflow profile each with nine configurable temperature zones.
• Three axis micrometer positioning system for precise BGA alignments.
• Split vision technology with color LCD display aids in the proper alignment of the BGA.
• Precision solder, combination of pre-heater and top heater to reach reflow temperature effectively minimizes overheat or under heating.
• Fast response IR lamp technology gives accurate and ample heating suitable for various IC packages and sizes
• With 75Watt high powered composite tip technology soldering Iron. Superb thermal recovery suitable for lead free soldering process.