Features:

• Integrates a hot air top heater, split-vision alignment, pre-heater, vacuum pick up pen and soldering Iron into one sophisticated reworking system.
• Micro-processor controlled system with full digital display of time, temperature and airflow parameters for maximum performance.
• Closed loop control accurately maintains the desired hot air internal temperature.
• Innovative three axis positioning system using precise micrometers for BGA alignment.
• Split vision technology with color LCD display aids in the proper alignment of the BGA.
• Precision solder. Combination of pre-heater and top heater to reach reflow temperature effectively minimizes overheat or under heating.
• Attachable nozzles. Over 60 different nozzles are available ensuring wide compatibility.
• Compatible with lead-free and standard solder process. (see page 54 for hot air nozzles)
• Integrated lead-free compatible soldering iron with a wide selection of lead free soldering iron tips.
• Versatile PCB holder that can accommodate PCBs sizes of up to 280 x 430 mm.